As it comes from the syringe, GTP 5's consistency is engineered for easy application. During the CPU's initial use, the compound thins out to enhance the filling of the microscopic valleys and ensure the best physical contact between the heatsink and the CPU core. Then the compound thickens slightly over the next 50 to 100 to its cured state.
There are 4 Principal Methods to apply GTP thermal paste, depending on your CPU:
1) The Vertical Line method is applicable with the following CPUs: Intel Core i3, i5, i7, and i7 Extreme with Metal Cap
Intel Core i3, i5, i7, vPro and Extreme with Metal Cap
Intel Core 2 Duo with Metal Cap
Intel Celeron Dual Core with Metal Cap
Xeon Series: 5500, 5200, 5100, 5000, 3500 and 3000 with Metal Cap
Xeon Series: E7: 8800, 4800 and 2800 and E3: 1200, L3406 with Metal Cap
2) The Horizontal Line method is applicable with the following CPUs: Intel Core 2 Quad with Metal Cap
Intel Core 2 Quad Extreme with Metal Cap
Intel Pentium Dual Core with Metal Cap
Intel Pentium D with Metal Cap
Xeon Series: 7000, 5400 and 5300 with Metal Cap
3) The Middle Dot method is applicable with the following CPUs: Intel Pentium 4 Or Legacy Single Core with Metal Cap
Intel Celeron D or Legacy Single Core with Metal Cap
Intel Xeon Series: Legacy Core with Metal Cap
AMD Phenom II x2 (x3, x4, x6), Phenom x3 (x4); Single Core (AMD Legacy)
AMD FX 8 (6,4) -Core CPU With a Metal Cap
AMD E2-Series, Dual-Core APU With a Metal Cap
AMD A4 (A6,A8) -Series, Dual-Core APU With a Metal Cap
AMD Athlon II x2 (3, 4); Athlon x2 Dual-Core, Athlon, Sempron
AMD Server Processors: Opteron Single-Core (Dual, Four, Six, Eight, Twelve)
4) The Surface Spread method is applicable with the following CPUs: Any Intel Mobile or Notebook CPU
Any Intel CPU without a Metal Cap
AMD APU Series E2, A4, A6 and A8 without a Metal Cap
Any AMD Notebook
IMPROVED PERFORMANCE: Graphitene Thermal Paste vastly outperforms any leading thermal paste on the market by up to 14.0? giving you more power out of your CPU!
BETTER COOLING: Compared to Silver, Graphene is 5x lighter, 12x more conductive, and flexible for much better surface contact which leads to better heat dissipation
SAFE APPLICATION: Not Electrically Conductive - GTP was formulated to conduct heat, not electricity.
LONGLASTING: Absolute Stability - GTP will not separate, run, migrate, or bleed.
EASY TO USE: 3 Easy Application methods to ensure top performance for your exact CPU