Intel Thermal Solution Cooling Fan/Heatsink for LGA2011 E5-2600 Processors (BXSTS200C)

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Manufacturer Description

Intel active boxed combo solution for 2-socket servers/workstations using e5-26xx & e5-16xx processors

Product Features

Pedestal chassis that provides adequate ventilation and correct temperature air to heat sink with fan removed 2U or larger rack chassis with ducted airflow to heat sink Pedestal chassis with ducted airflow to heat sink Max CPU TDP 130W Compatible Socket: LGA2011

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